SMT PCB LED production line

nyplkiman

SMT production line configuration plan (including site layout
implementation and training personnel)
Nanyue Panlong LED automatic placement machine
production line introduction:
Automatic plate feeder → automatic solder paste printing
machine → docking station → SMT multi-function placement
machine → docking station → 8 temperature zone lead-free
reflow soldering → automatic closing machine
Remarks: The SMT patch production line is fully automatic line
configuration, and only one operator is required for the entire
line.
● Up to 80 feeders can be placed on both sides
●Equipped with a variety of nozzles and can be manually
replaced
● Can be mounted with a variety of components: various
resistors, capacitors, IC, BGA, QFP, CFP, μBGA
●Maximum PCB board 800X330MM, suitable for all kinds of
PCB boards, flexible circuit boards, aluminum substrates.
●Meet the electronics factory, SMT processing plant, LED
application manufacturer, LED lamp manufacturers to install
LED3528, 5050, 3014, 0402, 0603, 0805, 1206, 1210, 1W high
power, 3W high power, IC and other devices, packaged
devices Tubes, triodes, etc., effectively improve the accuracy
and efficiency of placement, saving a lot of labor costs.
Conventional placement products
1, LED lights: LED bulbs, LED spotlights, LED lights, LED
ceiling lights.
2, lighting categories: LED wall washers, digital tube, barrier
tube, LED rainbow lights.
3, screen categories: LED surface display display, LED
modules.
4, high-power LED lights: LED ramps, street lights, spotlights,
lights, LED desk lamps, 1W ~ 3W plane, spherical,
double-peak LED.
5, electronic products: computer motherboard, MP3
motherboard, power motherboard, LED light power board, LED
power supply, LED driver, LED module, LED display.
6, suitable for LED products within 500X330MM size.
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Package size
Package size of SMD chip components:
Metric: 3216 - 2012 - 1608 - 1005 - 0603 - 0402
Imperial: 1206 - 0805 - 0603 - 0402 - 0201 - 01005
note:
0603 has metric, English distinction
The metric system 0603 is imperial 0201
The metric system of the English system 0603 is metric 1608
Also pay attention to the distinction between 1005 and 01005
1005 also has a metric system, the distinction between English
and English
The metric system of the British system 1005 is metric 2512
The metric system 1005 is the British system 0402
As in ProtelDXP (Protel2004) and later versions, there are
already package libraries for SMD chip components, such as
CC1005-0402: For chip capacitors, metric 1005, inch 0402
package
CC1310-0504: For chip capacitors, metric 1310, inch 0504
package
CC1608-0603: For chip capacitors, metric 1608, inch 0603
package
CR1608-0603: For chip resistors, metric 1608, inch 0603
package, the same size as CC16-8-0603, just for easy
identification.
Energy consumption characteristics
Energy-saving: NSKM-898 series placement machine uses the
latest energy-saving technology, the power supply of the whole
machine is 1.1 kW. The other brands of chip mounters have a
maximum power of 3 kW to 4 kW.
For example, industrial electricity is 1 yuan / kWh, 24 hours a
day, and 5 years is the unit of calculation.
Nanyue Panlong SMT machine power supply is 1.1 kW
1.1×24×365×5 years×1=48180 yuan/RMB
Through the above calculations, it can be seen that the
Nanyue Panlong placement machine saves more than
three-quarters of the electricity consumption cost compared to
other brand placement machines. The total energy saving cost
in five years is nearly 100,000 yuan.
SMT production line configuration
One. SMT basic process composition
two. SMT production process
Surface mount process
1 Single-sided assembly: (all surface mount components on
one side of the PCB)
Incoming material inspection -> solder paste mixing -> silk
screen solder paste -> patch -> reflow soldering 2
double-sided assembly; (surface mount components are on
both sides of PCB A, B)
Incoming material inspection -> PCB A-side silk-screen solder
paste -> SMD -> A-side reflow soldering -> Flip -> PCB B-side
silk-screen solder paste -> SMD -> B-side reflow soldering ->
(cleaning) -> Inspection -> Rework
2. Mixed process
1 Single-sided mixing process: (plug-in and surface mount
components are on the A side of the PCB)
Incoming material inspection -> solder paste mixing -> PCB A
side silk screen solder paste -> patch -> A surface reflow
soldering -> PCB Aside plug -> wave soldering or dip soldering
(a small number of plug-ins can be hand soldered) - >
(Cleaning) -> Inspection -> Rework (first post and then insert)
2 double-sided mixing process:
(Surface mount components are on the A side of the PCB, and
the plug-in is on the B side of the PCB)
A. Incoming material inspection -> solder paste mixing -> PCB
A-side silk screen solder paste -> patch -> reflow soldering ->
PCB B-side plug-in -> wave soldering (a small number of
plug-ins can be hand soldered) -> (cleaning )-> Inspection ->
Rework
B. Incoming material inspection -> PCB A-side silk-screen
solder paste -> SMD -> Manual pad on the A side of the PCB
pad solder paste -> PCB B-side insert -> Reflow soldering ->
(cleaning) - > Inspection -> Rework
(Surface mount components are on the A and B sides of the
PCB, and the plug-in is on either or both sides of the PCB)
Firstly, the double-sided assembly method is used to reflow the
surface mount components on both sides of the A and B sides
of the double-sided PCB, and then the manual soldering of the
plugs on both sides can be performed.
three. SMT process equipment introduction
1. Template: (steel mesh)
First, determine whether to process the template according to
the designed PCB. If the chip components on the PCB are only
resistors and capacitors and the package is more than 1206,
the template can be used without a template, and the solder
paste can be applied with a syringe or an automatic dispensing
device; when the PCB contains SOT, SOP, PQFP, PLCC and
The chip of the BGA package and the package of the resistor
and capacitor must be made of a template of 0805 or less. The
general template is divided into chemically etched copper
template (low price, suitable for small batch, test and chip lead
pitch > 0.635mm); laser etched stainless steel template (high
precision, high price, suitable for high volume, automatic
production line and chip pin Spacing <0.5mm). For R&D, small
batch production or pitch >0.5mm, our company recommends
the use of etched stainless steel stencils; for mass production
or laser cutting of stainless steel stencils with pitch <0.5mm.
The outer dimensions are 370*470 (unit: mm), and the
effective area is 300*400 (unit: mm).
2. Silk screen: (high-precision semi-automatic solder paste
printing machine)
Its function is to use a scraper to print solder paste or patch
glue onto the pads of the PCB to prepare the components for
mounting. The equipment used is a manual screen printing
station (screen printer), a stencil and a scraper (metal or
rubber) at the forefront of the SMT line. Our company
recommends using the medium screen printing table, the
precision semi-automatic screen printing machine method to
fix the template on the screen printing table, determine the
position of the PCB on the screen printing platform through the
upper and lower and left and right knobs on the manual screen
printing table, and fix the position; The PCB to be coated is
placed between the screen printing platform and the stencil.
Place the solder paste on the screen plate (at room
temperature), keep the stencil parallel to the PCB, and apply
the solder paste evenly on the PCB with a squeegee. During
the use, pay attention to the timely cleaning of the template
with alcohol to prevent the solder paste from clogging the leak
of the template.
3. Mounting: (Korea high-precision automatic multi-function
placement machine)
Its role is to accurately mount surface mount components to a
fixed location on the PCB. The equipment used is a placement
machine (automatic, semi-automatic or manual), vacuum pen
or tweezers, located behind the screen printing station in the
SMT production line. For the laboratory or small batch, our
company generally recommends the use of double-head
anti-static vacuum pen. In order to solve the problem of
placement and alignment of high-precision chips (chip pitch
<0.5mm), our company recommends the use of South Korea's
Samsung automatic multi-function high-precision placement
machine (model SM421 can improve efficiency and placement
accuracy). The vacuum pen can directly pick up the resistor,
capacitor and chip from the component rack. Since the solder
paste has a certain viscosity, the resistor and capacitor can be
placed directly at the desired position; for the chip, a suction
cup can be added to the vacuum pen tip. The amount of
suction can be adjusted with the knob. Remember to pay
attention to the alignment position regardless of the
components placed. If the position is misaligned, you must
clean the PCB with alcohol, re-screen, and reposition the
components.
4. Reflow soldering:
Its function is to melt the solder paste, so that the surface
mount components and the PCB are brazed together to
achieve the electrical performance required by the design and
are precisely controlled according to the international standard
curve, which can effectively prevent thermal damage and
deformation of the PCB and components. . The equipment
used is a reflow oven (automatic infrared/hot air reflow oven)
located behind the placement machine in the SMT line.
5. Cleaning:
Its function is to remove the electrical properties of the
mounted PCB or solder residues such as flux, etc., if the use of
no-clean solder can generally not be cleaned. For products
that require micro-power products or high-frequency
characteristics, they should be cleaned, and general products
can be cleaned free. The equipment used is an ultrasonic
cleaner or directly washed with alcohol, and the position may
not be fixed.
6. Inspection:
Its role is to test the quality and assembly quality of the
mounted PCB. The equipment used has a magnifying glass, a
microscope, and the position can be placed in a suitable place
on the production line according to the needs of the inspection.
7. Rework:
Its role is to rework PCBs that detect faults, such as solder
balls, tin bridges, open circuits and other defects. The tools
used are smart soldering irons, rework stations, etc. Configure
anywhere in the production line.
four. SMT assisted process: mainly used to solve the wave
soldering and reflow soldering mixing process.
1. Printed red plastic: (can also print red plastic)
The function is to print the red plastic to the fixed position of the
PCB. The main function is to fix the components to the PCB.
Generally, it is used for surface mount components on both
sides of the PCB and one side for wave soldering. The
equipment used for printing press paste and red offset printing
can be completed by one machine and is located at the
forefront of the SMT production line.
2. Curing: (Reflow soldering is better for curing and lead solder
paste)
Its function is to cure the patch adhesive, so that the surface
mount components and the PCB are firmly bonded together.
The equipment used is a curing oven (our company's reflow
oven can also be used for the curing of glue and heat aging
test of components and PCBs), located behind the placement
machine in the SMT production line.
Conclusion:
SMT surface mount technology includes many aspects, such
as electronic components, integrated circuit design and
manufacturing technology, electronic product circuit design
technology, automatic placement equipment design and
manufacturing technology, auxiliary materials development
and production technology used in assembly manufacturing,
electronics Product anti-static technology, etc., therefore, the
production of a complete, beautiful, system test performance of
electronic products will have many factors.
Complete set of surface mount equipment features
Surface Mount Technology (SMT) is a new generation of
electronic assembly technology. At present, most high-end
electronic products in China generally adopt SMT placement
technology. With the development of electronic technology,
surface mount technology will be an inevitable trend of the
electronics industry.

The  company ：Shenzhen Nanyue Panlong Technology Co., Ltd.
address ：225 Wanfeng Middle Road, Baoan District,
Shenzhen, Guangdong, China
Phone ：+860755-23500432
e Mobile  Number ：+8615220225689
E-Mail ： nypl-smt@foxmail.com
s whats  app ：+8615220225689
WeChat app：15220225689
Contact:kiman